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EVG 40 Top to Bottom Measurement System

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Price:
$33,150.00
SKU:
1BA50002
Brand:
Condition:
Used
Availability:
Ready in stock
Minimum Purchase:
1 unit(s)
Quantity:
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Product Description

EVG 40 Top to Bottom Measurement System

EVG®40

Substrate / wafer

parameters

Substrate size up to 200 mm

Substrate thickness Max. 10 mm

Alignment stage Chuck alignment stage

Y: ± 5 mm

X: ± 105 mm

Measurements

Accuracy < 0.5 μm (3σ

Repeatability 0.4 μm (3σ)

Reproducibility 0.4 μm (3σ)

Throughput 40 – 80 measurements / hour

Measurement types

Top-to-Bottom (T/B) -InfraredTransmitted

Microscopes

Camera Analog Digital

Objectives 5x, 10x, 20x

Depth of focus 55 μm (5x), 15 μm (10x), 6 μm (20x)

Focus drive Motorized

Autofocus N/A


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